某总线插头灌封胶在装配过程中出现脱黏和开裂，通过断口分析、力学性能试验、地面试验和空中试验等方法，对灌封胶脱黏和开裂的原因进行了分析。结果表明：灌封胶所使用的硅橡胶力学性能较差，在总线装配过程中弯折应力的作用下，总线插头灌封胶发生了脱黏和开裂；通过试验优选出一种高延伸率硅橡胶，与底涂工艺配合使用，可解决总线插头灌封胶脱黏和开裂的质量问题。

Debonding and cracking encapsulant for a bus plug appeared during assembly. The causes of debonding and cracking of the encapsulant were analyzed by means of fracture analysis, mechanical property test, ground test, air test and so on. The results show that the mechanical properties of the silicone rubber used in the encapsulant was not good enough, and debonding and cracking of the encapsulant happened under the bending stress during bus assembly. A kind of silicone rubber with high elongation was selected through experiments, which can be used with base coating process to solve the quality problems of debonding and cracking of the encapsulant of the bus plug.